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DRV8353M 数据表(PDF) 8 Page - Texas Instruments |
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DRV8353M 数据表(HTML) 8 Page - Texas Instruments |
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8 / 76 page  10 Thermal Information THERMAL METRIC(1) DRV8353M RTA (WQFN) 40 PINS RθJA Junction-to-ambient thermal resistance 26.1 RθJC(top) Junction-to-case (top) thermal resistance 13.1 RθJB Junction-to-board thermal resistance 8.4 ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 8.4 RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. DRV8353M SLVSFO2 – JULY 2020 www.ti.com 8 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: DRV8353M |
类似零件编号 - DRV8353M |
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类似说明 - DRV8353M |
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