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MMG3008NT1 Datasheet(数据表) 13 Page - NXP Semiconductors

部件型号  MMG3008NT1
说明  Heterojunction Bipolar Transistor (InGaP HBT)
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
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MMG3008NT1 Datasheet(HTML) 13 Page - NXP Semiconductors

 
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MMG3008NT1
13
RF Device Data
Freescale Semiconductor, Inc.
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
Refer to the following resources to aid your design process.
Application Notes
 AN1955: Thermal Measurement Methodology of RF Power Amplifiers
 AN3100: General Purpose Amplifier and MMIC Biasing
Software
 .s2p File
Development Tools
 Printed Circuit Boards
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to
Software & Tools on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
3
Mar. 2007
 Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS
compliant part numbers, pp. 6, 7
4
July 2007
 Replaced Case Outline 1514--01 with 1514--02, Issue D, pp. 1, 11--13. Case updated to add missing
dimension for Pin 1 and Pin 3.
5
Mar. 2008
 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
 Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
 Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, pp. 8, 9
6
Feb. 2012
 Corrected temperature at which ThetaJC is measured from 25Cto86C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
 Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
 Removed ICC bias callout from applicable graphs and Table 10, Common Emitter S--Parameters heading
as bias is not a controlled value, pp. 4--9
 Added .s2p File availability to Product Software and Printed Circuit Boards to Development Tools, p. 14
7
Sept. 2014
 Added Fig. 21, Product Marking, p. 9




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