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MMG3004NT1 数据表(PDF) 19 Page - NXP Semiconductors |
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MMG3004NT1 数据表(HTML) 19 Page - NXP Semiconductors |
19 / 21 page MMG3004NT1 19 RF Device Data Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier and MMIC Biasing AN3778: PCB Layout Guidelines for PQFN/QFN Style Packages Requiring Thermal Vias for Heat Dissipation Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office. REVISION HISTORY The following table summarizes revisions to this document. Revision Date Description 2 Mar. 2007 Replaced Case Outline 1543--02 with updated 1543--03, Issue C, pp. 1, 16--18 Added VCC callout to Pin Connections 10, 11, and 12 in Fig. 1, Pin Connections, p. 3 Updated Part Numbers in Table 8, Component Designations and Values, 900 MHz, to RoHS compliant part numbers, p. 5 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 5, 50 Ohm Test Circuit Component Layout, 900 MHz, p. 6 Removed IDC value due to its variability over temperature, Figs. 12--13, IS--95 Adjacent Channel Power Ratio versus Output Power, 900 MHz, p. 8 Updated Part Numbers in Table 9, Component Designations and Values, 1900--2200 MHz, to RoHS compliant part numbers, p. 9 Corrected circuit board callouts, Vp to VBA and VCC to VSUPPLY, Fig. 15, 50 Ohm Test Circuit Component Layout, 1900--2200 MHz, p. 10 Removed IDC value due to its variability over temperature, Figs. 22--23, IS--95 Adjacent Channel Power Ratio versus Output Power, 1900--2200 MHz, and Fig. 24, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power, 1900--2200 MHz, p. 12 Replaced Table 10, S--Parameters, pp. 13--15 Added Product Documentation and Revision History, p. 19 3 Mar. 2008 Corrected Tape and Reel information from 12 mm, 7--inch Reel to 16 mm, 13--inch Reel, p. 1 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 Corrected Fig. 24, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis (ACPR) unit of measure to dBc, p. 12 Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected frequency values from GHz to MHz, pp. 13, 14, 15 4 June 2009 Replaced Case Outline 1543--03, Issue C, with 1543--04, Issue D, pp. 1, 17--19. Corrected I/O dimension from 0.95--1.2 mm to 0.925--1.175 mm. Corrected temperature at which ThetaJC is measured from 25Cto88C, Thermal Characteristics table, p. 1 Replaced Figs. 12 and 22, IS--95 Adjacent Channel Power Ratio versus Output Power, with revised graphs, pp. 8, 12 (continued) |
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