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LM3202TL 数据表(PDF) 10 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 LM3202TL
功能描述  650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

LM3202TL 数据表(HTML) 10 Page - National Semiconductor (TI)

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Block Diagram
Operation Description
The LM3202 is a simple, step-down DC-DC converter opti-
mized for powering RF power amplifiers (PAs) in mobile
phones, portable communicators, and similar battery pow-
ered RF devices. It is designed to allow the RF PA to operate
at maximum efficiency over a wide range of power levels
from a single Li-Ion battery cell. It is based on a current-
mode buck architecture, with synchronous rectification for
high efficiency. It is designed for a maximum load capability
of 650mA in PWM mode.
Maximum load range may vary from this depending on input
voltage, output voltage and the inductor chosen.
Efficiency is typically around 96% for a 400mA load with
3.16V output, 3.6V input. The output voltage is dynamically
programmable from 1.3V (typ) to 3.16V (typ) by adjusting the
voltage on the control pin without the need for external
feedback resistors. This ensures longer battery life by being
able to change the PA supply voltage dynamically depending
on its transmitting power.
Additional features include current overload protection, ther-
mal overload shutdown and soft start.
The LM3202 is constructed using a chip-scale 8-pin micro
SMD package. This package offers the smallest possible
size, for space-critical applications such as cell phones,
where board area is an important design consideration. Use
of a high switching frequency (2MHz) reduces the size of
external components. As shown in Figure 1, only three ex-
ternal power components are required for implementation.
Use of a micro SMD package requires special design con-
siderations for implementation. (See Micro SMD Package
Assembly and use in the Applications Information section.)
Its fine bump-pitch requires careful board design and preci-
sion assembly equipment. Use of this package is best suited
for opaque-case applications, where its edges are not sub-
ject to high-intensity ambient red or infrared light. Also, the
system controller should set EN low during power-up and
other low supply voltage conditions. (See Shutdown Mode in
the Device Information section.)
20141535
FIGURE 2. Functional Block Diagram
www.national.com
10


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