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GRM188B11E203JA01 Datasheet(数据表) 3 Page - Murata Manufacturing Co., Ltd

部件型号  GRM188B11E203JA01
说明  Chip Monolithic Ceramic Capacitor for General
下载  30 Pages
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制造商  MURATA1 [Murata Manufacturing Co., Ltd]
网页  http://www.murata.com
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GRM188B11E203JA01 Datasheet(HTML) 3 Page - Murata Manufacturing Co., Ltd

 
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Temperature
Compensating Type
High Dielectric
Constant Type
10 Vibration
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Capacitance
Within the specified initial value.
Q or D.F.
Within the specified initial value.
Kind of Vibration
:
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude
: 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance
Within +/-5% or +/-0.5pF
Within +/-10%
Change
(Whichever is larger)
Pressurization method : Shown in Fig.2
Flexure 
   : 1mm
Holding Time
:
5+/-1s
Soldering Method
: Reflow soldering
12 Solderability
95% of the terminations is to be soldered evenly and continuously.
Test Method
:
Solder bath method
Flux
Solution of rojin ethanol 25(wt)%
Preheat
: 80℃ to 120℃ for 10s to 30s
Solder
: Sn-3.0Ag-0.5Cu
Solder Temp.
: 245+/-5℃
Immersion time
: 2+/-0.5s
13 Resistance to
Appearance
No defects or abnormalities.
<GRM03 size min.>
Soldering Heat
Capacitance
Within +/-2.5% or +/- 0.25pF
Within +/-7.5%
Test Method
:
Solder bath method
Change
(Whichever is larger)
Solder
: Sn-3.0Ag-0.5Cu
Solder Temp.
: 270+/-5℃
Q or D.F.
Within the specified initial value.
Immersion time
: 10+/-0.5s
Exposure Time
: 24+/-2h
I.R.
Within the specified initial value.
Preheat
: GRM31 size max.: 120℃ to 150℃ for 1 min
 
GRM32 size    : 100℃ to 120℃ for 1 min
Voltage proof No defects.
and 170℃ to 200℃ for 1 min
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
<GRM02 size only>
Test Method
: Reflow soldering (hot plate)
Solder
: Sn-3.0Ag-0.5Cu
Solder Temp.
: 270+/-5℃
Reflow Time
:
10+/-0.5s
Test Substrate
: Glass epoxy PCB
Exposure Time
: 24+/-2h
Preheat
: 120℃ to 150℃ for 1 min
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
14 Temperature
Appearance
No defects or abnormalities.
Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Capacitance
Within +/-2.5% or+/- 0.25pF
Within +/-7.5%
Change
(Whichever is larger)
Perform the five cycles according to the four heat treatments
shown in the following table.
Q or D.F.
Within the specified initial value.
I.R.
Within the specified initial value.
Voltage proof No defects.
Exposure Time
: 24+/-2h
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
Test Method
(Ref. Standard:JIS C 5101, IEC60384)
No
Item
Specification
Type
Applied Force(N)
GRM02
1
GRM03
2
GRM15/GRM18
5
GRM21/GRM31/GRM32
10
Step
Temp.(
C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-0001U
3




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