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GRM188B11E112JA01 Datasheet(数据表) 17 Page - Murata Manufacturing Co., Ltd

部件型号  GRM188B11E112JA01
说明  Chip Monolithic Ceramic Capacitor for General
下载  30 Pages
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制造商  MURATA1 [Murata Manufacturing Co., Ltd]
网页  http://www.murata.com
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GRM188B11E112JA01 Datasheet(HTML) 17 Page - Murata Manufacturing Co., Ltd

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4-1.Reflow Soldering
1. When sudden heat is applied to the components, the
[Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
[Allowable Reflow Soldering Temperature and Time]
shown in the table 1.
Table 1
Series
GRM
GRM
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Caution
Lead Free Solder
Peak Temperature
Air or N2
Atmosphere
ΔT≦130℃
Temperature Differential
Inverting the PCB
240 to 260℃
Chip Dimension(L/W) Code
01/02/03/15/18/21/31
32/43/55
ΔT≦190℃
!
Temperature(℃)
Peak Temperature
Soldering
Gradual
Cooling
Preheating
ΔT
60-120 seconds
30-60 seconds
Time
190℃
170℃
150℃
220℃
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
JEMCGC-2701X
17




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