BC807−16LT1, BC807−25LT1, BC807−40LT1

http://onsemi.com

4

PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−09

ISSUE AI

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.1102

0.1197

2.80

3.04

INCHES

B

0.0472

0.0551

1.20

1.40

C

0.0385

0.0498

0.99

1.26

D

0.0140

0.0200

0.36

0.50

G

0.0670

0.0826

1.70

2.10

H

0.0040

0.0098

0.10

0.25

J

0.0034

0.0070

0.085

0.177

K

0.0180

0.0236

0.45

0.60

L

0.0350

0.0401

0.89

1.02

S

0.0830

0.0984

2.10

2.50

V

0.0177

0.0236

0.45

0.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

4. 318−01, −02, AND −06 OBSOLETE, NEW STANDARD 318−09.

1

3

2

A

L

BS

V

G

D

H

C

K

J

STYLE 6:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

ON Semiconductor and

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