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CD4013B Datasheet(数据表) 1 Page - Silicon Supplies

部件型号  CD4013B
说明  CMOS High Voltage Logic
下载  6 Pages
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制造商  SS [Silicon Supplies]
网页  https://siliconsupplies.com/
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CD4013B Datasheet(HTML) 1 Page - Silicon Supplies

   
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 CMOS High Voltage Logic – CD4013B
 
Dual D-Type Flip-Flop Logic IC with Set and Reset in bare die form
Rev 1.0
21/11/17
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
Die Size (Unsawn)
1400 x 1500
55 x 59
µm
mils
Minimum Bond Pad Size
100 x 100
3.94 x 3.94
µm
mils
Die Thickness
350 (±20)
13.78 (±0.79)
µm
mils
Top Metal Composition
Al 1%Si 1.1µm
Back Metal Composition
N/A – Bare Si
High Input Voltage up to 20V
Symmetrical Output Characteristics
Max input current 1µA at 18V over full Military
Temperature Range
Set-Reset Capability & Static Flip-Flop Operation  
Drives x2 Low–power TTL or x1 LSTTL Load
Direct drop-in replacement for obsolete
components in long term programs.
Features:
The following part suffixes apply:
No suffix - MIL-STD-883 /2010B Visual Inspection
“H” - MIL-STD-883 /2010B Visual Inspection
+ MIL-PRF-38534 Class H LAT
Description
The CD4013B is fabricated using a 3µm 15CMOS
process and consists of two identical, independent
data type flip-flops. Each flip-flop has separate data,
set, reset, clock inputs and Q,Q outputs. The device
can be used in Shift Register applications and also
Counter or Toggle applications by connecting Q output
to the data input. The logic level present at the “D”
input is transferred to the Q output during the positive-
going transition of the clock pulse. Setting or resetting
is clock independent and accomplished by a high level
on the respective Set or Reset line.
Ordering Information
Die Dimensions in µm (mils)
1400 (55)
“K” - MIL-STD-883 /2010A Visual Inspection (Space)
+ MIL-PRF-38534 Class K LAT
LAT = Lot Acceptance Test.
For further information on LAT process flows see below.
www.siliconsupplies.com\quality\bare-die-lot-qualification
Supply Formats:
Mechanical Specification
Default – Die in Waffle Pack (100 per tray capacity)
Sawn Wafer on Tape – On request
Unsawn Wafer – On request
Die Thickness <> 350µm(14 Mils) – On request
Assembled into Ceramic Package – On request
Page 1 of 6 
www.siliconsupplies.com




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