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ISO7761FQDBQQ1 数据表(PDF) 31 Page - Texas Instruments |
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ISO7761FQDBQQ1 数据表(HTML) 31 Page - Texas Instruments |
31 / 43 page 31 ISO7760-Q1, ISO7761-Q1 ISO7762-Q1, ISO7763-Q1 www.ti.com SLLSEU7 – NOVEMBER 2018 Product Folder Links: ISO7760-Q1 ISO7761-Q1 ISO7762-Q1 ISO7763-Q1 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated 12.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. |
类似零件编号 - ISO7761FQDBQQ1 |
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类似说明 - ISO7761FQDBQQ1 |
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