2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

V

−0.3V to 5.8V

SD pin: Voltage to GND

-0.3V to

(V

5.8V max

Output Short-to-GND Duration

(Note 3)

1 sec.

Maximum Junction Temperature

(T

150˚C

Storage Temperature Range

-65˚C to +150˚C

Pad Temperature

(Soldering, 10 sec.)

265˚C

ESD Rating (Note 4)

Human-body model

Machine model

2kV

200V

Input Voltage Range

1.8V to 5.5V

Junction Temperature (T

-40˚C to +90˚C

Ambient Temperature (T

(Note 5)

-40˚C to +85˚C

Thermal Properties

Junction-to-Ambient Thermal

220˚C/W

Resistance (

θ

(Note 6)

Electrical Characteristics

(Notes 2, 7)

Limits in standard typface are for T

range (-40˚C

≤ T

J

≤ +90˚C). Unless otherwise noted: specifications apply to the LM2781 Typical Application Circuit (pg. 1) with

V

Symbol

Parameter

Conditions

Min

Typ

Max

Units

R

OUT

Output Resistance

(Note 9)

I

8

30

Ω

I

18

40

Ω

I

Q

Supply Current

No load

0.7

1.4

mA

I

SD

Shutdown Supply Current

V(SD) = 5.0V

0.1

0.5

µA

F

SW

Switching Frequency

100

210

400

kHz

V

SD

Shutdown Pin Logic Levels

Normal Operation

1.8V

≤ V

IN

≤ 5.5V

0

0.5

V

Shutdown Mode

1.8V

≤ V

IN

≤ 5.5V

0.5xV

IN

V

IN

V

OUTp-p

Output Voltage Ripple

V

10

mV

P

EFF

Power Efficiency

V

92

%

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the

Electrical Characteristics table.

Note 2: All voltages are with respect to the potential at the GND pin.

to GND may damage the device, and should be avoided.

Note 4: The human-body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged

directly into each pin.

Note 6: Junction-to-ambient thermal resistance of the micro SMD package is highly application and board-layout dependent.

Note 7: Max and Min limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 9: Output resistance is a model for the voltage drop at the output, resulting from internal switch resistance, capacitor ESR, and charge pump charge transfer

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