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NB7NPQ7022M 数据表(PDF) 3 Page - ON Semiconductor

部件名 NB7NPQ7022M
功能描述  3.3V USB 3.1 Dual Channel High Gain Linear Redriver
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制造商  ONSEMI [ON Semiconductor]
网页  http://www.onsemi.com
标志 ONSEMI - ON Semiconductor

NB7NPQ7022M 数据表(HTML) 3 Page - ON Semiconductor

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3
Figure 2. UQFN16 Package Pinout (Top View)
A_TX−
A_TX+
B_RX−
B_RX+
12
11
10
9
A_RX−
A_RX+
B_TX−
B_TX+
1
2
3
4
5
6
7
8
13
14
15
16
Exposed
Pad EP
Table 1. PIN DESCRIPTION
Pin No. Pin Name
Type
Description
1
A_RX−
DIFF IN
Channel A Differential input pair for 5 / 10 Gbps USB signals. Must be externally AC−coupled.
2
A_RX+
3
B_TX−
DIFF OUT Channel B Differential output for 5 / 10 Gbps USB signals. Must be externally AC−coupled.
4
B_TX+
5
VCC
POWER
3.3 V power supply. VCC pins must be externally connected to power supply to guarantee proper oper-
ation.
6
CTRL_B0 LVCMOS IN Pin B0 for control of Flat Gain settings on Channel B having internal 100 kW pull up and 200 kW pull
down resistors. 4 state input: HIGH “H” where pin is connected to VCC, LOW “L” where pin is connect-
ed to Ground, FLOAT “F” where the pin is left floating (open) and Rext “R” where an external resistor
68 kW connected from pin to Ground. Refer Table 2 for the different settings.
7
CTRL_B1 LVCMOS IN Pin B1 for control of Equalization settings on Channel B having internal 100 kW pull up and 200 kW pull
down resistors. 4 state input: HIGH “H” where pin is connected to VCC, LOW “L” where pin is connect-
ed to Ground, FLOAT “F” where the pin is left floating (open) and Rext “R” where an external resistor
68 kW connected from pin to Ground. Refer Table 2 for the different settings.
8
GND
GND
Reference Ground. GND pins must be externally connected to power supply ground to guarantee
proper operation.
9
B_RX+
DIFF IN
Channel B Differential input pair for 5 / 10 Gbps USB signals. Must be externally AC coupled.
10
B_RX−
11
A_TX+
DIFF OUT Channel A Differential output for 5 / 10 Gbps USB signals. Must be externally AC coupled.
12
A_TX−
13
VCC
POWER
3.3 V power supply. VCC pins must be externally connected to power supply to guarantee proper oper-
ation.
14
CTRL_A0 LVCMOS IN Pin A0 for control of Equalization settings on Channel A having internal 100 kW pull up and 200 kW pull
down resistors. 4 state input: HIGH “H” where pin is connected to VCC, LOW “L” where pin is connect-
ed to Ground, FLOAT “F” where the pin is left floating (open) and Rext “R” where an external resistor
68 kW connected from pin to Ground. Refer Table 2 for the different settings.
15
CTRL_A1 LVCMOS IN Pin A1 for Control of Flat Gain settings on Channel A having internal 100 kW pull up and 200 kW pull
down resistors. 4 state input: HIGH “H” where pin is connected to VCC, LOW “L” where pin is connect-
ed to Ground, FLOAT “F” where the pin is left floating (open) and Rext “R” where an external resistor
68 kW connected from pin to Ground. Refer Table 2 for the different settings.
16
GND
GND
Reference Ground. GND pins must be externally connected to power supply ground to guarantee
proper operation.
EP
GND
GND
Exposed pad (EP). EP on the package bottom is thermally connected to the die for improved heat
transfer out of the package. The pad is not electrically connected to the die, but is recommended to be
soldered to GND on the PC Board.


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