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APX9151S 数据表(PDF) 15 Page - Anpec Electronics Coropration |
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APX9151S 数据表(HTML) 15 Page - Anpec Electronics Coropration |
15 / 16 page Copy r ight © ANPEC Electronics Corp. Rev . A. 4 - Nov . , 2 0 1 7 APX9 1 5 1 S w w w .anpec.com .t w 1 5 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3 °C/second max. Liquidous temperature (TL) Time at liquidous (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body Temperature (Tp)* See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5 °C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Cla ssifica t ion Re flow Pr of ile s Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Volume mm 3 ≥350 <2.5 mm 235 °C 220 °C ≥2.5 mm 220 °C 220 °C Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness Volume mm 3 <350 Volume mm 3 350-2000 Volume mm 3 >2000 <1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C ≥2.5 mm 250 °C 245 °C 245 °C Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245 °C HOLT JESD-22, A108 1000 Hrs, Bias @ Tj=125 °C PCT JESD-22, A102 168 Hrs, 100 %RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65 °C~150°C HBM MIL-STD-883-3015.7 VHBM≧2KV MM JESD-22, A115 VMM≧200V Latch-Up JESD 78 10ms, 1tr≧100mA Re lia bilit y Te st Pr og r a m |
类似零件编号 - APX9151S |
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类似说明 - APX9151S |
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