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MCP120 数据表(PDF) 7 Page - Microchip Technology |
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MCP120 数据表(HTML) 7 Page - Microchip Technology |
7 / 16 page 2001 Microchip Technology Inc. DS11184D-page 7 MCP120/130 3.2 Package Detail Information 3-Lead Plastic Transistor Outline (TO) (TO-92) 4 3 2 4 3 2 β Mold Draft Angle Bottom 6 5 4 6 5 4 α 0.56 0.48 0.41 .022 .019 .016 B Lead Width 0.51 0.43 0.36 .020 .017 .014 c Lead Thickness 2.41 2.29 2.16 .095 .090 .085 R Molded Package Radius 4.95 4.64 4.32 .195 .183 .170 D Overall Length 4.95 4.71 4.45 .195 .186 .175 E1 Overall Width 3.94 3.62 3.30 .155 .143 .130 A Bottom to Package Flat 1.27 .050 p Pitch 3 3 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units R n 1 3 α p L B A c β 1 D 2 E1 Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49 *Controlling Parameter Mold Draft Angle Top Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 |
类似零件编号 - MCP120 |
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类似说明 - MCP120 |
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