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ISL97692 数据表(PDF) 30 Page - Renesas Technology Corp |
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ISL97692 数据表(HTML) 30 Page - Renesas Technology Corp |
30 / 32 page ISL97692, ISL97693, ISL97694A FN7839 Rev.6.00 Page 30 of 32 Sep 8, 2017 Package Outline Drawing W4x4.16B 4x4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) Rev 2, 8/13 BOTTOM VIEW TYPICAL RECOMMENDED LAND PATTERN TOP VIEW SIDE VIEW NOTES: 1. Dimensions and tolerance and tolerance per ASMEY 14.5 - 1994. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. 5. All dimensions are in millimeters. 6. NSMD refers to non-solder mask defined pad design per Intersil Techbrief www.intersil.com/data/tb/tb451.pdf Ø0.10 Ø0.05 Z Z XY M M PIN 1 PACKAGE 0.10 Z 0.265±0.035 0.200±0.030 0.500±0.050 0.10 (4X) X Y 43 21 A B C D 3 SEATING PLANE Z 1.655±0.03 1.655±0.03 1.200 1.200 0.400 0.400 0.200 0.290 0.240 0.400 16X 0.265±0.035 0.295 2 6 NSMD 0.228 0.228 (A1 CORNER) OUTLINE 4 For the most recent package outline drawing, see W4x4.16B. |
类似零件编号 - ISL97692 |
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类似说明 - ISL97692 |
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