LB-20 datasheet(1/1 Pages) ETC

部件名	LB-20

功能描述	Effect of PWB Copper Area on Thermal Performance of 20-Lead SOIC LB Package

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制造商	ETC [List of Unclassifed Manufacturers]

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For the double-layer copper board, the

copper area on the bottom is identical

to the area on the top. Both the top and

bottom layers are thermally connected

through vias placed on each ground

lead.

Variable Copper Area Test Board

Red-hatched area is copper on the surface of the PWB

The 20 lead LB package has 4 ground

leads as shown. Additional copper

area must be connected to these

leads.

Thermal Resistance (RθJA) vs. Copper Area on PWB

Effect of PWB Copper Area on Thermal Performance

of 20−Lead SOIC LB Package

Copper Area Must Be Connected to

Package Ground Leads

Using a Double-Layer PWB

5 6

16 15

40

50

60

70

80

90

100

01234

Area of Copper on Board (in

2)

One side Copper

Two side Copper

类似零件编号 - LB-20

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