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ISL1557IRZ 数据表(PDF) 11 Page - Renesas Technology Corp |
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ISL1557IRZ 数据表(HTML) 11 Page - Renesas Technology Corp |
11 / 12 page ISL1557 FN7522 Rev 3.00 Page 11 of 12 Apr 6, 2018 HMSOP (Heat-Sink MSOP) Package Family 1 (N/2) (N/2)+1 N PLANE SEATING N LEADS 0.10 C PIN #1 I.D. E1 E b DETAIL X 3° ±3° GAUGE PLANE SEE DETAIL "X" c A 0.25 A2 A1 L 0.25 C A B D A M B e C 0.08 C A B M H L1 END VIEW SIDE VIEW TOP VIEW E2 BOTTOM VIEW D1 EXPOSED THERMAL PAD MDP0050 HMSOP (HEAT-SINK MSOP) PACKAGE FAMILY SYMBOL MILLIMETERS TOLERANCE NOTES HMSOP8 HMSOP10 A1.00 1.00 Max. - A1 0.075 0.075 +0.025/-0.050 - A2 0.86 0.86 ±0.09 - b 0.30 0.20 +0.07/-0.08 - c 0.15 0.15 ±0.05 - D 3.00 3.00 ±0.10 1, 3 D1 1.85 1.85 Reference - E 4.90 4.90 ±0.15 - E1 3.00 3.00 ±0.10 2, 3 E2 1.73 1.73 Reference - e 0.65 0.50 Basic - L 0.55 0.55 ±0.15 - L1 0.95 0.95 Basic - N8 10 Reference - Rev. 1 2/07 NOTES: 1. Plastic or metal protrusions of 0.15mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25mm maximum per side are not included. 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. For the most recent package outline drawing, see MDP0050. |
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