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S34ML01G1 Datasheet(数据表) 57 Page - Cypress Semiconductor

部件型号  S34ML01G1
说明  1 Gb/2 Gb/4 Gb, 3 V, SLC NAND Flash for Embedded
下载  71 Pages
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制造商  CYPRESS [Cypress Semiconductor]
网页  http://www.cypress.com
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S34ML01G1 Datasheet(HTML) 57 Page - Cypress Semiconductor

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Document Number: 002-00676 Rev. *V
Page 57 of 71
S34ML01G1
S34ML02G1
S34ML04G1
7.1.2
63-Pin Ball Grid Array (BGA)
Figure 50. VBM063 — 63-Pin BGA, 11 mm x 9 mm Package
g5011\ 16-038.25 \ 6.5.13
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION
3, SPP-020.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE TOTAL NUMBER OF POPULATED SOLDER
BALL POSITIONS FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
“SD” AND “SE” ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW “SD” OR “SE” = 0.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, “SD” = eD/2 AND “SE” = eE/2.
8. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE
VBM 063
JEDEC
M0-207(M)
11.00 mm x 9.00 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.00
PROFILE
A1
0.25
---
---
BALL HEIGHT
D
11.00 BSC.
BODY SIZE
E
9.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
63
BALL COUNT
b
0.40
0.45
0.50
BALL DIAMETER
eE
0.80 BSC.
BALL PITCH
eD
0.80 BSC.
BALL PITCH
SD
0.40 BSC.
SOLDER BALL PLACEMENT
SE
0.40 BSC.
SOLDER BALL PLACEMENT
A3-A8,B2-B8,C1,C2,C9,C10
DEPOPULATED SOLDER BALLS
D1,D2,D9,D10,E1,E2,E9,E10
F1,F2,F9,F10,G1,G2,G9,G10
H1,H2,H9,H10,J1,J2,J9,J10
K1,K2,K9,K10
L3-L8,M3-M8




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