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DAC8811 Datasheet(数据表) 2 Page - Texas Instruments

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部件型号  DAC8811
说明  16-Bit, Serial Input Multiplying Digital-to-Analog Converter
下载  15 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
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 2 page
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www.ti.com
ABSOLUTE MAXIMUM RATINGS
DAC8811
SLAS411A – NOVEMBER 2004 – REVISED DECEMBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
MINIMUM
RELATIVE
DIFFERENTIAL
PACKAGE-
SPECIFIED
TRANSPORT
ACCURACY
NONLINEARITY
LEAD
TEMPERATURE
PACKAGE
ORDERING
MEDIA,
PRODUCT
(LSB)
(LSB)
(DESIGNATOR)
RANGE
MARKING
NUMBER
QUANTITY
DAC8811C
±1
±1
MSOP-8 (DGK)
-40
°C to +85°C
D11
DAC8811ICDGKT
Tape and Reel, 250
DAC8811C
±1
±1
MSOP-8 (DGK)
-40
°C to +85°C
D11
DAC8811ICDGKR
Tape and Reel, 2500
DAC8811C
±1
±1
SON-8 (DRB)
-40
°C to +85°C
D11
DAC8811ICDRBT
Tape and Reel, 250
DAC8811C
±1
±1
SON-8 (DRB)
-40
°C to +85°C
D11
DAC8811ICDRBR
Tape and Reel, 2500
DAC8811B
±2
±1
MSOP-8 (DGK)
-40
°C to +85°C
D11
DAC8811IBDGKT
Tape and Reel, 250
DAC8811B
±2
±1
MSOP-8 (DGK)
-40
°C to +85°C
D11
DAC8811IBDGKR
Tape and Reel, 2500
DAC8811B
±2
±1
SON-8 (DRB)
-40
°C to +85°C
D11
DAC8811IBDRBT
Tape and Reel, 250
DAC8811B
±2
±1
SON-8 (DRB)
-40
°C to +85°C
D11
DAC8811IBDRBR
Tape and Reel, 2500
(1)
For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet or
refer to our web site at www.ti.com.
over operating free-air temperature range (unless otherwise noted)(1)
DAC8811
UNIT
VDD to GND
-0.3 to +7
V
Digital input voltage to GND
-0.3 to +VDD + 0.3
V
V (IOUT) to GND
-0.3 to +VDD + 0.3
V
Operating temperature range
-40 to +105
°C
Storage temperature range
-65 to +150
°C
Junction temperature range (TJ max)
+125
°C
Power dissipation
(TJ max - TA) / RΘJA
Thermal impedance, RΘJA
55
°C/W
Lead temperature, soldering
Vapor phase (60s)
215
°C
Lead temperature, soldering
Infrared (15s)
220
°C
ESD rating, HBM
1500
V
ESD rating, CDM
1000
V
(1)
Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2




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