www.onsemi.com

24

Physical Dimensions

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

A. CONFORMS TO JEDEC REGISTRATION MO-229,

VARIATION VEEC, DATED 11/2001

ASME Y14.5M, 1994

RECOMMENDED LAND PATTERN

0.05

0.00

2X

2X

0.8 MAX

SEATING

PLANE

D. FILENAME: MKT-MLP08Drev2

Figure 58. 3x3 mm , 8-Lead Molded Leadless Package (MLP)

Package drawings are provided as a service to customers considering ON Semiconductor components. Drawings may change in

any manner without notice. Please note the revision and/or date on the drawing and contact an ON Semiconductor representative to

verify or obtain the most recent revision. Package specifications do not expand the terms of ON Semiconductor’s worldwide terms

and conditions, specifically the warranty therein, which covers ON Semiconductor products.