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LTM8056 数据表(PDF) 19 Page - Linear Technology |
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LTM8056 数据表(HTML) 19 Page - Linear Technology |
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19 / 28 page  LTM8056 19 8056fa For more information www.linear.com/LTM8056 APPLICATIONS INFORMATION can exhibit different thermal behavior, so it is incumbent upon the user to verify proper operation over the intended system’sline,loadandenvironmentaloperatingconditions. ThethermalresistancenumberslistedinthePinConfigura- tion of the data sheet are based on modeling the µModule package mounted on a test board specified per JESD 51-9 (TestBoardsforAreaArraySurfaceMountPackageThermal Measurements). The thermal coefficients provided on this page are based on JESD 51-12 (Guidelines for Reporting and Using Electronic Package Thermal Information). Forincreasedaccuracyandfidelitytotheactualapplication, many designers use FEA to predict thermal performance. To that end, the Pin Configuration of the data sheet typi- cally gives four thermal coefficients: θJA – Thermal resistance from junction to ambient. θJCbottom–Thermalresistancefromjunctiontothebottom of the product case. θJCtop – Thermal resistance from junction to top of the product case. θJB – Thermal resistance from junction to the printed circuit board. While the meaning of each of these coefficients may seem to be intuitive, JEDEC has defined each to avoid confusion and inconsistency. These definitions are given in JESD 51-12, and are quoted or paraphrased below: θJA is the natural convection junction-to-ambient air thermal resistance measured in a one cubic foot sealed enclosure. This environment is sometimes referred to as “still air” although natural convection causes the air to move. This value is determined with the part mounted to a JESD 51-9 defined test board, which does not reflect an actual application or viable operating condition. θJCbottom is the thermal resistance between the junction andbottomofthepackagewithallofthecomponentpower dissipation flowing through the bottom of the package. In the typical µModule converter, the bulk of the heat flows out the bottom of the package, but there is always heat flow out into the ambient environment. As a result, this thermal resistance value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJCtopisdeterminedwithnearlyallofthecomponentpower dissipation flowing through the top of the package. As the electricalconnectionsofthetypicalµModuleconverterare on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junc- tion to the top of the part. As in the case of θJCbottom, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJB is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the µModule converter and into the board, and is really the sum of the θJCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a 2-sided, 2-layer board. This board is described in JESD 51-9. Giventhesedefinitions,itshouldnowbeapparentthatnone of these thermal coefficients reflects an actual physical operating condition of a µModule converter. Thus, none of them can be individually used to accurately predict the thermal performance of the product. Likewise, it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature versus load graphs givenintheproduct’sdatasheet.Theonlyappropriateway to use the coefficients is when running a detailed thermal analysis, such as FEA, which considers all of the thermal resistances simultaneously. |
类似零件编号 - LTM8056 |
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类似说明 - LTM8056 |
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