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LTM8049 数据表(PDF) 13 Page - Linear Technology

部件名 LTM8049
功能描述  Dual SEPIC or Inverting 關Module DC/DC Converter
Download  20 Pages
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制造商  LINER [Linear Technology]
网页  http://www.linear.com
标志 LINER - Linear Technology

LTM8049 数据表(HTML) 13 Page - Linear Technology

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LTM8049
13
8049fa
For more information www.linear.com/LTM8049
APPLICATIONS INFORMATION
Frequency Foldback
The frequency foldback function reduces the switching
frequency for that channel when the output is about 15%
below the target regulation point. This feature lowers the
operatingfrequency,thuscontrollingthemaximumoutput
current during start-up. When the FBX voltage is pulled
above the above mentioned range in a positive output volt-
age application, the switching frequency for that channel
runs that the rate set by the RT resistor value. Note that
the maximum output current at start-up is a function of
many variables including load profile, output capacitance,
target VOUT, VIN, switching frequency, so the user must
evaluate the performance of the LTM8049 to ensure that
it properly powers up its load.
Thermal Shutdown
If the part is too hot, the LTM8049 engages its thermal
shutdown and terminates switching and discharges the
soft-startcapacitor.Whentheparthascooled,thepartauto-
maticallyrestarts.Thisthermalshutdownissettoengageat
temperaturesabovethe125°Cabsolutemaximuminternal
operating rating to ensure that it does not interfere with
functionality in the specified operating range. This means
that internal temperatures will exceed the 125°C absolute
maximum rating when the overtemperature protection is
active, possibly impairing the device’s reliability.
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8049. The LTM8049 is neverthe-
less a switching power supply, and care must be taken to
minimize EMI and ensure proper operation. Even with the
high level of integration, you may fail to achieve specified
operation with a haphazard or poor layout. See Figure 2
for a suggested layout. Ensure that the grounding and
heat-sinking are acceptable.
A few rules to keep in mind are:
1. Place the RFBX and RT resistors as close as possible to
their respective pins.
2. Place the CIN capacitor as close as possible to the VIN
and GND connection of the LTM8049.
3. Place the COUT capacitor as close as possible to the
VOUT and GND connection of the LTM8049.
Figure 2. Layout Showing Suggested External Components, GND Plane and Thermal Vias
8049 F02
THERMAL/GND VIAS
VIN2
VIN1
VOUT1
(POSITIVE OUTPUT)
VOUT2
(NEGATIVE OUTPUT)
GND
GND
GND
GND
SHARE2
SHARE1
SS1
SS2 RUN2
RUN1
SYNC1
SYNC2
RT1
RT2
PG2
PG1
FBX1
FBX2
CLKOUT1 CLKOUT2
GND
CIN1
CIN2
COUT1
COUT2


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