Version 1.5 (not for new design)

LE ACWUWV S2W

2017-06-26

19

Lötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions

Preconditioning acc. to JEDEC Level 2

Reflow Lötprofil für bleifreies Löten

(nach J-STD-020D.01)

Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020D.01)

0

0

s

OHA04525

50

100

150

200

250

300

50

100

150

200

250

300

t

T

˚C

S

t

t

P

t

T

p

240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

OHA04612

Profil-Charakteristik

Profile Feature

25 °C to 150 °C

2

3

K/s

Time t

S

T

t

S

t

L

t

P

T

L

T

P

100

120

60

10

20

30

80

100

217

2

3

245

260

3

6

Time

25 °C to T

P

Time within 5 °C of the specified peak

temperature T

Ramp-down Rate*

T

P

to

100 °C

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

T

Smax

to

T

P

Liquidus Temperature

Peak Temperature

Time above Liquidus temperature

Symbol

Symbol

Einheit

Unit

Pb-Free (SnAgCu) Assembly

Minimum

Maximum

Recommendation

K/s

K/s

s

s

s

s

°C

°C

480