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TMP1075DGKT 数据表(PDF) 4 Page - Texas Instruments

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部件名 TMP1075DGKT
功能描述  Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75 Form Factor and Pinout
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TMP1075DGKT 数据表(HTML) 4 Page - Texas Instruments

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4
TMP1075
SBOS854 – MARCH 2018
www.ti.com
Product Folder Links: TMP1075
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Power supply, V+
6
V
Input voltage
–0.5
6
V
Input voltage
–0.5
(V+) + 0.5
V
Input current
10
mA
Operating temperature
–55
150
°C
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–60
130
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
2K
V
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
TBD
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Supply voltage
1.7
5.5
V
Operating free-air temperature, TA
–55
150
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
TMP1075
UNIT
DGK (SOIC),
D (VSSOP)
8 PINS
RθJA
Junction-to-ambient thermal resistance
202.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
82
°C/W
RθJB
Junction-to-board thermal resistance
124.4
°C/W
ψJT
Junction-to-top characterization parameter
17.9
°C/W
ψJB
Junction-to-board characterization parameter
122.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
TBD
°C/W
Thermal Mass
TBD
TBD


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