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TMP1075DGKT 数据表(PDF) 4 Page - Texas Instruments |
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TMP1075DGKT 数据表(HTML) 4 Page - Texas Instruments |
4 / 26 page 4 TMP1075 SBOS854 – MARCH 2018 www.ti.com Product Folder Links: TMP1075 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Power supply, V+ 6 V Input voltage –0.5 6 V Input voltage –0.5 (V+) + 0.5 V Input current 10 mA Operating temperature –55 150 °C Junction temperature, TJ 150 °C Storage temperature, Tstg –60 130 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2K V Charged device model (CDM), per JEDEC specification JESD22-C101(2) TBD 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage 1.7 5.5 V Operating free-air temperature, TA –55 150 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TMP1075 UNIT DGK (SOIC), D (VSSOP) 8 PINS RθJA Junction-to-ambient thermal resistance 202.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 82 °C/W RθJB Junction-to-board thermal resistance 124.4 °C/W ψJT Junction-to-top characterization parameter 17.9 °C/W ψJB Junction-to-board characterization parameter 122.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance TBD °C/W Thermal Mass TBD TBD |
类似零件编号 - TMP1075DGKT |
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类似说明 - TMP1075DGKT |
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