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FAN65004B 数据表(PDF) 22 Page - ON Semiconductor |
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FAN65004B 数据表(HTML) 22 Page - ON Semiconductor |
22 / 26 page FAN65004B www.onsemi.com 22 Figure 46. Power Stage, Loop Gain and Compensator Bode Plots For ease of calculation, with C1 >> C3: ƒ z1 + 1 2 p @ (R10 ) R9) @ C9 ƒ z2 + 1 2 p @ R8 @ C7 ƒ p2 + 1 2 p @ R9 @ C9 ƒ p3 + 1 2 p @ R8 @ C8 ƒc + V IN 2 p @ V Ramp @ R10 @ C7 Thermal Considerations The temperature gradients on the FAN65004B are shown below. While measuring the thermal performance, place the thermocouple at the hottest spot of the IC (not at the center of the part). Layout Guidelines 1. Place RT resistor and SS capacitor close to RT and SS pins. 2. Use a low impedance source such as a logic gate to drive the SYNC pin and keep the PCB trace as short as possible. 3. Components of digital signals like EN/UVLO, PGOOD and SYNC can be placed far away from device. 4. Place BOOT capacitor right next to BOOT and PH pins. If flexibility of high−side MOSFET driving strength is desired, place a resistor in series with this BOOT capacitor. For Vin > 40 V, use Rboot = 2 ohm. 5. Place inductor on top layer. Restrict the SW trace to only cover the inductor pin but keep its trace as wide as possible for thermal relief. 6. Avoid all the compensation components from passing through, above or underneath switching trace. 7. Keep the switching nodes away from sensitive small signal nodes (FB). Ideally the switch nodes printed circuit traces should be routed away and separated from the IC and especially the quiet side of the IC. Separate the high dv/dt traces from sensitive small−signal nodes with ground traces or ground planes. 8. Place decoupling caps right next to PVCC, VCC , HVBIAS and EXTBIAS. 9. The output capacitors should be placed as close to the load as possible. Use short wide copper regions to connect output capacitors to load to avoid inductance and resistances. |
类似零件编号 - FAN65004B |
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类似说明 - FAN65004B |
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