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AD1671 数据表(PDF) 2 Page - Analog Devices |
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AD1671 数据表(HTML) 2 Page - Analog Devices |
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2 / 7 page  AD1671 ASD0010777 Rev. M | Page 2 of 7 3.0 Absolute Maximum Ratings. (TA = 25°C, unless otherwise noted) VCC to ACOM.............................................................................................................-0.5V to +6.5V VEE to ACOM.............................................................................................................-6.5V to +0.5V VLOGIC to DCOM.........................................................................................................-0.5V to +6.5V ACOM to DCOM........................................................................................................-1.0V to +1.0V VCC to VLOGIC ..............................................................................................................-6.5V to +6.5V ENCODE to DCOM....................................................................................................-0.5V to VLOGIC +0.5V REF IN, BPO/UPO to ACOM ....................................................................................-0.5V to VCC +0.5V AIN to ACOM.............................................................................................................-11V to +11V Power Dissipation .....................................................................................................1000mW Operating Temperature Range..................................................................................-55°C to +125°C Storage Temperature Range.....................................................................................-65°C to +150°C Lead Temperature (Soldering, 60 sec.) ....................................................................+300°C Junction Temperature (TJ).........................................................................................+150°C 3.1. Thermal Characteristics: Thermal Resistance, SBDIP (D) Package Junction-to-Case (ΘJC) = 28°C/W Max Junction-to-Ambient (ΘJA) = 60°C/W Max Thermal Resistance, Bottom brazed (F) Package Junction-to-Case (ΘJC) = 22°C/W Max Junction-to-Ambient (ΘJA) = 60°C/W Max Figure 2. Functional block diagram |
类似零件编号 - AD1671_17 |
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类似说明 - AD1671_17 |
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