CYStech Electronics Corp.

Spec. No. : C024H8

Issued Date : 2017.12.08

Revised Date :

Page No. : 10/10

MTB014N15RH8

CYStek Product Specification

DFN5×6 Dimension

Millimeters

Inches

Millimeters

Inches

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.90

1.10

0.035

0.043

E2

3.38

3.78

0.133

0.149

A1

0.00

0.05

0.000

0.002

e

1.27 BSC

0.050 BSC

b

0.33

0.51

0.013

0.020

H

0.41

0.61

0.016

0.024

C

0.20

0.30

0.008

0.012

K

1.10

-

0.043

-

D1

4.80

5.00

0.189

0.197

L

0.51

0.71

0.020

0.028

D2

3.61

3.96

0.142

0.156

L1

0.06

0.20

0.002

0.008

E

5.90

6.10

0.232

0.240

θ

8°

12°

8°

12°

E1

5.70

5.80

0.224

0.228

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking:

Date Code

Device Name

B014

N15R

8-Lead DFN5×6 Plastic Package

CYS Package Code : H8