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AD4000BRMZ 数据表(PDF) 9 Page - Analog Devices |
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AD4000BRMZ 数据表(HTML) 9 Page - Analog Devices |
9 / 36 page Data Sheet AD4000/AD4004/AD4008 Rev. C | Page 9 of 36 ABSOLUTE MAXIMUM RATINGS Note that the input overvoltage clamp cannot sustain the overvoltage condition for an indefinite amount of time. Table 5. Parameter Rating Analog Inputs IN+, IN− to GND1 −0.3 V to VREF + 0.4 V or ±130 mA2 Supply Voltage REF, VIO to GND −0.3 V to +6.0 V VDD to GND −0.3 V to +2.1 V VDD to VIO −6 V to +2.4 V Digital Inputs to GND −0.3 V to VIO + 0.3 V Digital Outputs to GND −0.3 V to VIO + 0.3 V Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Lead Temperature Soldering 260°C reflow as per JEDEC J-STD-020 ESD Ratings Human Body Model 4 kV Machine Model 200 V Field Induced Charged Device Model 1.25 kV 1 See the Analog Inputs section for an explanation of IN+ and IN−. 2 Current condition tested over a 10 ms time interval. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Table 6. Thermal Resistance Package Type1 θJA2 θJC3 Unit RM-10 147 38 °C/W CP-10-9 114 33 °C/W 1 Test Condition 1: thermal impedance simulated values are based upon use of 2S2P JEDEC PCB. See the Ordering Guide. 2 θJA is the natural convection junction-to-ambient thermal resistance measured in a one cubic foot sealed enclosure. 3 θJC is the junction-to-case thermal resistance. ESD CAUTION |
类似零件编号 - AD4000BRMZ |
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类似说明 - AD4000BRMZ |
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