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RT5508 数据表(PDF) 55 Page - Richtek Technology Corporation |
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RT5508 数据表(HTML) 55 Page - Richtek Technology Corporation |
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55 / 57 page  RT5508 Copyright © 2017 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation DS5508-01 March 2017 www.richtek.com 55 The output ripple can be determined as following equation : OUT S OUT IN S OUT C_esr OUT Boost D I T I V D T ΔV = + ( + ) r η C 1-D 2 L For the application of the RT5508 to boost VBAT to 5.3V, a 10 F for input capacitor, an 22F for boost capacitor and a 100nF for DVDD decoupling capacitor are recommended. RL () Value ( F) Manufacturer Part Number Description Size/Height (mm) 8 10 (2pcs) Murata GRM188R61E106M X5R/15%/25V 0603/0.8 8 22 Murata GRM219R61C226ME15 X5R/15%/16V 0805/0.85 6 10 (2pcs) Murata GRM188R61E106M X5R/15%/25V 0603/0.8 6 22 Murata GRM219R61C226ME15 X5R/15%/16V 0805/0.85 Filter Free Operation and Ferrite Bead Filters A ferrite bead filter can often be used if the design is failing radiated emissions without an LC filter and the frequency sensitive circuit is greater than 1MHz. This filter functions well for circuits that just have to pass FCC and CE because FCC and CE only test radiated emissions greater than 30MHz. When choosing a ferrite bead, choose one with high impedance at high frequencies, and low impedance at low frequencies. Typically, impedance rises over 150 before 30MHz to provide at least 20dB decade is minimum requirement (such as TDK : MPZ1608S221A). In addition, select a ferrite bead with adequate current rating to prevent distortion of the output signal. Figure 24 Ferrite Chip Bead OUTP OUTN 1nF Ferrite Chip Bead 1nF Figure 25 Thermal Considerations The junction temperature should never exceed the absolute maximum junction temperature TJ(MAX), listed under Absolute Maximum Ratings, to avoid permanent damage to the device. The maximum allowable power dissipation depends on the thermal resistance of the IC package, the PCB layout, the rate of surrounding airflow, and the difference between the junction and ambient temperatures. The maximum power dissipation can be calculated using the following formula : PD(MAX) = (TJ(MAX) TA) / JA where TJ(MAX) is the maximum junction temperature, TA is the ambient temperature, and JA is the junction-to-ambient thermal resistance. For continuous operation, the maximum operating junction temperature indicated under Recommended Operating Conditions is 125 C. The junction-to- ambient thermal resistance, JA, is highly package dependent. For WL-CSP-29B 2.87x2.07 (BSC) package, the thermal resistance, JA, is 33.3C/W on a standard JEDEC 51-7 high effective-thermal- conductivity four-layer test board. The maximum power dissipation at TA = 25C can be calculated as below : |
类似零件编号 - RT5508 |
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类似说明 - RT5508 |
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