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UA741MJG 数据表(PDF) 3 Page - Texas Instruments |
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UA741MJG 数据表(HTML) 3 Page - Texas Instruments |
3 / 19 page µA741, µA741Y GENERAL-PURPOSE OPERATIONAL AMPLIFIERS SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 µA741Y chip information This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C. TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. + – OUT IN + IN – VCC+ (7) (3) (2) (6) (4) VCC – (5) (1) OFFSET N2 OFFSET N1 45 36 (1) (8) (7) (6) (5) (4) (3) (2) |
类似零件编号 - UA741MJG |
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类似说明 - UA741MJG |
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