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SL3S30 数据表(PDF) 7 Page - NXP Semiconductors |
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SL3S30 数据表(HTML) 7 Page - NXP Semiconductors |
7 / 9 page Philips Semiconductors Short Form Specification, Revision 3.0 October 2003 UCODE HSL SL3ICS30 01 7 3.2 Memory • 2048 bits • 64 bits UID in memory bytes 0 to 7. • 216 bytes with user definable access conditions for memory bytes 8 to 223 • Data retention of 10 years • Write endurance of 100 kcycles 3.3 Security • Unique serial number for each device • Lock mechanism (write protection) for each byte. 4 ORDERING INFORMATION Table 2: Ordering Information ORDERING NAME ORDERING CODE OPTIONAL DESCRIPTION SL3ICS30 01 FW/V4 9352 740 15005 Bumped, sawn wafer on FFC, 150 µm, inked and mapped SL3S30 01FTT 9352 741 69118 Packaged die in TSSOP8 package |
类似零件编号 - SL3S30 |
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类似说明 - SL3S30 |
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