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TLC2274AMWB 数据表(PDF) 5 Page - Texas Instruments |
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TLC2274AMWB 数据表(HTML) 5 Page - Texas Instruments |
5 / 33 page 5 TLC2274AM-MIL www.ti.com SLOS986 – JUNE 2017 Product Folder Links: TLC2274AM-MIL Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to the midpoint between VDD+ and VDD–. (3) Differential voltages are at IN+ with respect to IN–. Excessive current will flow if input is brought below VDD– – 0.3 V. (4) The output may be shorted to either supply. Temperature or supply voltages must be limited to ensure that the maximum dissipation rating is not exceeded. 6 Specifications 6.1 Absolute Maximum Ratings over operating ambient temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VDD+ (2) 8 V VDD– (2) –8 V Differential input voltage, VID (3) ±16 V Input voltage, VI (any input) (2) VDD− − 0.3 VDD+ V Input current, II (any input) ±5 mA Output current, IO ±50 mA Total current into VDD+ ±50 mA Total current out of VDD– ±50 mA Duration of short-circuit current at (or below) 25°C(4) Unlimited Operating ambient temperature range, TA –55 125 Storage temperature, Tstg –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) Devices in D packages ±2000 V Charged-device model (CDM), per AEC Q100-011 Devices in D packages ±1000 6.3 Recommended Operating Conditions MIN MAX UNIT VDD± Supply voltage ±2.2 ±8 V VI Input voltage VDD− VDD+ − 1.5 V VIC Common-mode input voltage VDD− VDD+ − 1.5 V TA Operating ambient temperature –55 125 °C (1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics. (2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability. (3) The package thermal impedance is calculated in accordance with JESD 51-7 (plastic) or MIL-STD-883 Method 1012 (ceramic). 6.4 Thermal Information THERMAL METRIC(1) TLC2274AM-MIL UNIT D (SOIC) J (CDIP) FK (LCCC) N (PDIP) W (CFP) 14-PIN 14-PIN 20-PIN 14-PIN 14-PIN RθJA Junction-to-ambient thermal resistance (2)(3) 115.6 — — — °C/W RθJC(top) Junction-to-case (top) thermal resistance (2)(3) 61.8 16.2 18 121.3 °C/W RθJB Junction-to-board thermal resistance 55.9 — — — °C/W ψJT Junction-to-top characterization parameter 14.3 — — — °C/W ψJB Junction-to-board characterization parameter 55.4 — — — °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 8.68 °C/W |
类似零件编号 - TLC2274AMWB |
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