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TMP125AIDBVTG4 数据表(PDF) 2 Page - Texas Instruments

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部件名 TMP125AIDBVTG4
功能描述  Accurate Digital Temperature Sensor with SPI田?Interface
Download  12 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TMP125AIDBVTG4 数据表(HTML) 2 Page - Texas Instruments

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TMP125
SBOS323A − DECEMBER 2004 − REVISED JUNE 2005
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage
+7V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage(2)
−0.3V to +7V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Current
±10mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Short Circuit(3)
Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range
−55
°C to +125°C
. . . . . . . . . . . . . . .
Storage Temperature Range
−60
°C to +150°C
. . . . . . . . . . . . . . . . .
Junction Temperature (TJ max)
+150
°C
. . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (soldering)
+300
°C
. . . . . . . . . . . . . . . . . . . . . . . .
ESD Rating (Human Body Model)
4000V
. . . . . . . . . . . . . . . . . . . .
(Charged Device Model)
1000V
. . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input terminals are diode-clamped to the power-supply rails.
Input signals that can swing more than 0.5V beyond the supply
rails should be current limited to 10mA or less.
(3) Short-circuit to ground.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE DESIGNATOR
PACKAGE MARKING
TMP125
SOT23-6
DBV
T125
TMP125
SOT23-6
DBV
T125
TMP125
SOT23-6
DBV
T125
TMP125
SOT23-6
DBV
T125
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATION
Top View
GND
SI
V+
NOTE: Pin 1 is determined by orienting
the package marking as shown.
SOT23−6
SO
CS
SCK
1
2
3
6
5
4
TMP125


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