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IIS328DQ 数据表(PDF) 36 Page - STMicroelectronics |
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IIS328DQ 数据表(HTML) 36 Page - STMicroelectronics |
36 / 40 page Soldering information IIS328DQ 36/40 DocID027250 Rev 3 9 Soldering information The QFPN-24 package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020C, in MSL3 condi- tions. For complete land pattern and soldering recommendations, please refer to the technical note TN0019 available on www.st.com. 9.1 General guidelines for soldering surface-mount accelerometers The following three elements must be considered in order to adhere to common PCB design and good industrial practices when soldering MEMS sensors: 1. PCB with its own conductive layers (i.e. copper) and other organic materials used for board protection and dielectric isolation. 2. ACCELEROMETER to be mounted on the board. The accelerometer senses acceleration, but it senses also the mechanical stress coming from the board. This stress is minimized with simple PCB design rules. 3. SOLDER PASTE like SnAgCu. This solder paste can be dispensed on the board with a screen printing method through a stencil. The pattern of the solder paste on the PCB is given by the stencil mask itself. 9.2 PCB design guidelines PCB land and solder mask general recommendations are shown in Figure 13. Refer to Figure 12 for specific device size, land count and pitch. It is recommended to open the solder mask external to the PCB land. It is mandatory, for correct device functionality, to ensure that some clearance is present between the accelerometer thermal pad and PCB. In order to obtain this clearance it is recommended to open the PCB thermal pad solder mask. The area below the sensor (on the same side of the board) must be defined as a keepout area. It is strongly recommended not to place any structure in the top metal layer underneath the sensor. Traces connected to pads should be as symmetrical as possible. Symmetry and balance for pad connection helps component self-alignment and leads to better control of solder paste reduction after reflow. For better performance over temperature it is strongly recommended not to place large insertion components like buttons or shielding boxes at distances less than 2 mm from the sensor. Central die pad and “Pin 1 Indicator” are physically connected to GND. Leave “Pin 1 Indicator” unconnected during soldering. |
类似零件编号 - IIS328DQ |
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类似说明 - IIS328DQ |
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