数据搜索系统,热门电子元器件搜索 |
|
SI7611DN 数据表(PDF) 11 Page - Vishay Siliconix |
|
SI7611DN 数据表(HTML) 11 Page - Vishay Siliconix |
11 / 13 page www.vishay.com 4 Document Number 71681 03-Mar-06 Vishay Siliconix AN822 CONCLUSIONS As a derivative of the PowerPAK SO-8, the PowerPAK 1212-8 uses the same packaging technology and has been shown to have the same level of thermal perfor- mance while having a footprint that is more than 40 % smaller than the standard TSSOP-8. Recommended PowerPAK 1212-8 land patterns are provided to aid in PC board layout for designs using this new package. The PowerPAK 1212-8 combines small size with attrac- tive thermal characteristics. By minimizing the thermal rise above the board temperature, PowerPAK simplifies thermal design considerations, allows the device to run cooler, keeps rDS(ON) low, and permits the device to handle more current than a same- or larger-size MOS- FET die in the standard TSSOP-8 or SO-8 packages. Figure 5. Spreading Copper - Si7401DN 45 55 65 75 85 95 105 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 Spreading Copper (sq. in.) 100 % 50 % 0 % Figure 6. Spreading Copper - Junction-to-Ambient Performance 50 60 70 80 90 100 110 120 130 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 Spreading Copper (sq. in.) 100 % 0 % 50 % |
类似零件编号 - SI7611DN |
|
类似说明 - SI7611DN |
|
|
链接网址 |
隐私政策 |
ALLDATASHEETCN.COM |
ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |