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VSSAF3N50 数据表(PDF) 3 Page - Vishay Siliconix |
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VSSAF3N50 数据表(HTML) 3 Page - Vishay Siliconix |
3 / 5 page VSSAF3N50 www.vishay.com Vishay General Semiconductor Revision: 24-Jul-14 3 Document Number: 87720 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 4 - Typical Reverse Leakage Characteristics Fig. 5 - Typical Junction Capacitance Fig. 6 - Typical Transient Thermal Impedance Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Area 0.1 1 10 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Instantaneous Forward Voltage (V) T A = 150 °C T A = 25 °C T A = 100 °C T A = 125 °C 0.001 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 Percent of Rated Peak Reverse Voltage (%) T A = 150 °C T A = 125 °C T A = 100 °C T A = 25 °C 10 100 1000 10 000 0.1 1 10 100 Reverse Voltage (V) T J = 25 °C f = 1.0 MHz V sig = 50 mVp-p 1 10 100 1000 0.01 0.1 1 10 100 t - Pulse Duration (s) Junction to Ambient 0 20 40 60 80 100 120 140 02468 10 Copper Pad Areas (cm2) Scu (cm2) Epoxy printed circuit board FR4 copper thickness = 70 μm |
类似零件编号 - VSSAF3N50 |
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类似说明 - VSSAF3N50 |
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