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HLMP-LM75 数据表(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-LM75 数据表(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 11 page 9 Ammo Packs Drawing 6.35±1.30 0.25±0.0512 9.125±0.625 0.3593±0.025 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 20.5±1.00 0.8071±0.0394 12.70±1.00 0.50±0.0394 VIEW A - A 0.70±0.20 0.276±0.0079 4.00±0.20 0.1575±0.0079 Ø TYP. CATHODE Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255° C ± 5° C (maximum peak temperature = 260° C) Dwell time: 3.0 sec - 5.0 sec (maximum = 5 sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec Max TIME (sec) 260° C Max 105° C Max |
类似零件编号 - HLMP-LM75 |
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类似说明 - HLMP-LM75 |
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