Avago Technologies

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HLMP-HG74/75, HLMP-HM74/75, HLMP-HB74/75

Data Sheet

Avago Color Bin on CIE 1931 Chromaticity Diagram

Avago Color Bin on CIE 1931 Chromaticity

Diagram

Precautions

Lead Forming



The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on the PC board.



For better control, it is recommended to use the proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.



If manual lead cutting is necessary, cut the leads after the

soldering process. The solder connection forms a

mechanical ground that prevents mechanical stress due to

lead cutting from traveling into LED package. This is highly

recommended for hand solder operation, as the excess

lead length also acts as small heat sink.

Soldering and Handling



Care must be taken during PCB assembly and soldering

process to prevent damage to the LED component.



The LED component may be effectively hand soldered to

PCB. However, it is only recommended under unavoidable

circumstances, such as rework. The closest manual

soldering distance of the soldering heat source (soldering

iron’s tip) to the body is 1.59 mm. Soldering the LED using

soldering iron tip closer than 1.59 mm might damage the

LED.



ESD precaution must be properly applied on the soldering

station and personnel to prevent ESD damage to the LED

component that is ESD sensitive. Refer to Avago

application note AN 1142 for details. The soldering iron

used should have a grounded tip to ensure that

electrostatic charge is properly grounded.



Recommended soldering condition follows.



Wave soldering parameters must be set and maintained

according to the recommended temperature and dwell

time. The customer is advised to perform a daily check on

the soldering profile to ensure that it always conforms to

the recommended soldering conditions.

NOTE

1.

PCBs with different size and design (component

density) will have different heat mass (heat

capacity). This might cause a change in

temperature experienced by the board if the

same wave soldering setting is used. So, it is

recommended to re-calibrate the soldering

profile again before loading a new type of PCB.

2.

Avago Technologies’ high brightness LEDs use a

high efficiency LED die with single wire bond as

shown on the next page. The customer is advised

to take extra precautions during wave soldering

to ensure that the maximum wave temperature

does not exceed 260 °C and the solder contact

time does not exceed 5 s. Over-stressing the LED

during soldering process might cause premature

failure to the LED due to delamination.

0.000

0.200

0.400

0.600

0.800

1.000

0.000

0.100

0.200

0.300

0.400

0.500

0.600

0.700

0.800

X

Green

Red

Blue

2

2

3

3

4

4

a.

The above conditions refer to measurement with a thermocouple

mounted at the bottom of PCB.

b.

It is recommended to use only bottom preheaters to reduce thermal

stress experienced by the LED.

Manual Solder

Dipping

Pre-heat temperature 105 °C Max.

—

Preheat time

60 s Max

—

Peak temperature

260 °C Max.

260 °C Max.

Dwell time

5 s Max.

5 s Max

1.59 mm