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HLMP-AB70 数据表(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-AB70 数据表(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED |
8 / 10 page 8 Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec Max TIME (sec) 260°C Max 105°C Max Ammopack Drawing Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 6.35 ± 1.30 0.250 ± 0.051 9.125 ± 0.625 0.3595 ± 0.0245 18.00 ± 0.50 0.7085 ± 0.0195 12.70 ± 0.30 0.500 ± 0.012 20.5 ± 1.00 0.8070 ± 0.0394 12.70 ± 1.00 0.500 ± 0.039 CATHODE VIEW A - A 0.70 ± 0.20 0.276 ± 0.0075 4.00 ± 0.20 0.1575 ± 0.0075 TYP. |
类似零件编号 - HLMP-AB70 |
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类似说明 - HLMP-AB70 |
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