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HLMP-C123 数据表(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-C123 数据表(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED |
8 / 10 page 8 1.59 mm Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. LED Component Lead Size Diagonal Plated Through- Hole Diameter Lead size (typ.) 0.45 × 0.45 mm (0.018 × 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) Dambar shear- off area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) Lead size (typ.) 0.50 × 0.50 mm (0.020 × 0.020 in.) 0.707 mm (0.028 in) 1.05 to 1.15 mm (0.041 to 0.045 in) Dambar shear- off area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) • Over-sizing the PTH can lead to a twisted LED after it is clinched. On the other hand, undersizing the PTH can make inserting the TH LED difficult. For more information about soldering and handling of TH LED lamps, refer to application note AN5334. Wave Soldering[1],[2] Manual Solder Dipping Pre-heat Temperature 105°C Max. – Pre-heat Time 60 sec Max. – Peak Temperature 250°C Max. 260°C Max. Dwell Time 3 sec Max. 5 sec Max. Notes: 1. These conditions refer to measurement with a thermocouple mounted at the bottom of PCB. 2. To reduce thermal stress experienced by the LED, it is recommended that you use only the bottom preheaters. • ESD precaution must be properly applied on the soldering station and by personnel to prevent ESD damage to the LED component that is ESD sensitive. For details, refer to Avago application note AN 1142. The soldering iron used should have a grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering conditions: |
类似零件编号 - HLMP-C123 |
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类似说明 - HLMP-C123 |
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