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SM-BGA-9006 数据表(PDF) 3 Page - Ironwood Electronics. |
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SM-BGA-9006 数据表(HTML) 3 Page - Ironwood Electronics. |
3 / 3 page PAGE 3 of 3 Status: Released Drawing: E. Smolentseva Scale: NA Rev: A Date: 10/10/11 Modified: File: SM-BGA-9006 Dwg.mcd SM-BGA-9006 Drawing © 2011 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com D E e Y X Ø0.15 Ø0.08 Z X Y Øb 3 DETAIL TOP VIEW SIDE VIEW 3 4 5 Dimensions are in millimeters. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. Compatible BGA Spec 0.20 BOTTOM VIEW DIM MIN MAX A 1.70 A1 0.25 0.35 b 0.48 D E e 0.8 BSC Array: 19x19 0.38 15.85 16.15 16.15 15.85 A A1 DETAIL 0.12 Z Z 0.20 Z 5 4 |
类似零件编号 - SM-BGA-9006 |
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类似说明 - SM-BGA-9006 |
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