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SM-BGA-9029 数据表(PDF) 3 Page - Ironwood Electronics. |
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SM-BGA-9029 数据表(HTML) 3 Page - Ironwood Electronics. |
3 / 5 page D E 0.15 A B G e b (X100) 0.150 M C 0.08 M C A B A1 A DETAIL G SCALE 16 : 1 0.10 0.20 C Ironwood Package Code: BGA100C 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C. 4. Datum C (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. DIM Minimum Maximum A 1.28 1.44 A1 0.25 0.35 b 0.45 D 9.00 BSC E 9.00 BSC e 0.8 BSC ARRAY 10 x 10 PIN COUNT 100 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Socket for 9x9mm 0.8mm 10x10 array BGA100 Primary dimension units are millimeters, Secondary dimension units are [inches]. STATUS: Released REV. B DATE: 04/18/2013 Material: Finish: Weight: SM-BGA-9029 Drawing SCALE: 6:1 SHEET: 3 OF 5 DRAWN BY: E. Smolentseva FILE: SM-BGA-9029 Dwg |
类似零件编号 - SM-BGA-9029 |
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类似说明 - SM-BGA-9029 |
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