D

E

A

B

A

A1

0.08 C

C

D1

E1

e

b

14.500

Dimensions are in millimeters.

1.

Interpret dimensions and tolerances per ASME Y14.5M-1994.

2.

Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

3.

Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

4.

Parallelism measurement shall exclude any effect of mark on top surface of package.

5.

IRONWOOD PACKAGE CODE: BGA788C1

DIM

MIN

MAX

A

1.70

A1

0.15

b

0.25

0.35

D

15.90

16.10

E

15.90

16.10

D1

14.50 BSC

E1

14.50 BSC

e

0.50 BSC

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 12/20/2012

Material: N/A

Finish: N/A

Weight: 16.52

SM-BGA-9025 Drawing

SCALE: 4:1

SHEET: 3 OF 4

DRAWN BY: M. Raske

FILE: SM-BGA-9025 Dwg