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LS-BGA60C-61 数据表(PDF) 1 Page - Ironwood Electronics. |
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LS-BGA60C-61 数据表(HTML) 1 Page - Ironwood Electronics. |
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1 / 1 page 0.8mm typ. 6.4mm [0.252"] 9mm [0.354"] 8mm [0.315"] 0.8mm [0.031"] 0.9mm [0.035"] 4.57mm [0.180"] 0.2mm dia. [0.008"] 7.2mm [0.283"] Status: Released Drawing: M.A. Fedde Scale: 6:1 Rev: C Date: 2/25/08 Modified: 01/17/13, DH File: LS-BGA60C-61 Dwg.mcd LS-BGA60C-61 Drawing Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Pins: material- Brass Alloy 360 1/2 hard; finish- 0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material; Non-clad 2 1 1 2 Top View Side View Description: Giga-snaP BGA SMT Foot 60 position terminal pins (0.8mm centers, 8x10 array) to SMT solder balls (BGA type). Pin asignment 1:1. © 2008 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com RoHS RoHS |
类似零件编号 - LS-BGA60C-61 |
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类似说明 - LS-BGA60C-61 |
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