Y

X

Tooling hole (X2)

See BGA pattern code to the

right for actual pattern layout

0.20mm [0.008"] dia.

1.93mm

[0.076"]

3.52mm

[0.139"]

Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]

FR4/G10 or equivalent high temp material. 17µm

[1/2 oz.] Cu clad. SnPb plating.

Pins: material- Brass Alloy 360 1/2 hard; finish-

0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).

2

Side View

(reference only)

Top View

(reference only)

2

1

Top View of Land Pattern

Scale: 2:1

Description: Land Socket.

48 position 0.75mm pitch BGA SMT land pattern to male pins.

Array Size

8x6

Pitch

0.75mm

Pin Count

48

Adapter Perimeter (XxY) 6.77mm [0.266"] x 5.27mm [0.207"]

Status: Released

Drawing: H. Hansen

Scale: N/A

Rev: A

Date: 11/4/05

Modified:

File: LS-BGA48N-61 Dwg

LS-BGA48N-61 Drawing

© 2005 IRONWOOD ELECTRONICS, INC.

PO BOX21151 ST. PAUL, MN 55121

Tele: (651) 452-8100

www.ironwoodelectronics.com

Tolerances: diameters ±0.03mm [±0.001”], PCB

perimeters ±0.13mm [±0.005”], PCB thicknesses

±0.18mm [±0.007"], pitches (from true position)

±0.08mm [±0.003"], all other tolerances ±0.13mm

[±0.005”] unless stated otherwise. Materials and

specifications are subject to change without

notice.

1

BGA48N

3.75mm

[0.148"]

5.25mm

[0.207"]

0.75mm typ.

BGA pad

Ø 0.41mm [Ø 0.016"]