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ADP1051-240-EVALZ 数据表(PDF) 9 Page - Analog Devices

部件名 ADP1051-240-EVALZ
功能描述  Versatile digital voltage mode controller
Download  93 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP1051-240-EVALZ 数据表(HTML) 9 Page - Analog Devices

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ADP1050
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage (Continuous) VDD
4.2 V
Digital Pins (OUTA, OUTB, SR1, SR2, PG/ALT,
SDA, SCL) to AGND
−0.3 V to VDD + 0.3 V
VS−, VS+, VF, OVP, RTD, ADD, CS1 to AGND
−0.3 V to VDD + 0.3 V
SYNI/FLGI, CTRL
−0.3 V to VDD + 0.3 V
Operating Temperature Range (TA)
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
240°C
RoHS-Compliant Assemblies (20 sec to
40 sec)
260°C
ESD Charged Device Model
1.25 kV
ESD Human Body Model
5.0 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
20-Lead LFCSP
37.05
1.53
°C/W
SOLDERING
It is important to follow the correct guidelines when laying out
the printed circuit board (PCB) footprint for the ADP1050 and
for soldering the device onto the PCB. For detailed information
about these guidelines, see the AN-772 Application Note, A Design
and Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP).
ESD CAUTION
Rev. A | Page 8 of 92


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