Si7050/1/3/4/5-A20

8

Rev. 1.14

Table 5. Thermal Characteristics

Parameter

Symbol

Test Condition

DFN-6

Unit

Junction to Air Thermal Resistance

JEDEC 2-Layer board,

No Airflow

256

°C/W

Junction to Air Thermal Resistance

JEDEC 2-Layer board,

1 m/s Airflow

224

°C/W

Junction to Air Thermal Resistance

JEDEC 2-Layer board,

2.5 m/s Airflow

205

°C/W

Junction to Case Thermal Resistance

JEDEC 2-Layer board

22

°C/W

Junction to Board Thermal Resistance

JEDEC 2-Layer board

134

°C/W

Table 6. Absolute Maximum Ratings1

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Ambient temperature

under bias

–55

—

125

°C

Storage Temperature2

–65

—

150

°C

Voltage on I/O pins

–0.3

—

VDD+0.3 V

V

Voltage on VDD with

respect to GND

–0.3

4.2

V

ESD Tolerance

HBM

—

—

2

kV

CDM

—

—

1.25

kV

MM

—

—

250

V

Notes:

1.

Absolute maximum ratings are stress ratings only, operation at or beyond these conditions is not implied and may

shorten the life of the device or alter its performance.

2.

Special handling considerations apply; see application note, “AN607: Si70xx Humidity and Temperature Sensor

Designer’s Guide”.