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UA2-5SNUN-L 数据表(PDF) 6 Page - Kemet Corporation |
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UA2-5SNUN-L 数据表(HTML) 6 Page - Kemet Corporation |
6 / 17 page 6 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R7004_UA2_UB2 • 2/27/2014 Miniature Signal Relays – UA2/UB2 Series Soldering Process UA2 – Through-hole Mounting Automatic Soldering Preheating: 110–120°C / 110 seconds (maximum) Solder temperature: 260°C maximum Solder time: 5 seconds maximum Note: KEMET recommends cooling down a printed circuit board to less than 110°C within 40 seconds after soldering. Manual Soldering Solder temperature: 350°C maximum Solder time: 3 seconds maximum UB2 – Surface Mounting Note: Temperatureprofileshowsprintedcircuitboardsurfacetemperatureontherelayterminalportion. PleaseconsultKEMETifyouwishtouseatemperatureprofileotherthanabove. IRS Method 200 180 190 (Maximum 300) 45 (Maximum 70) 70 (Maximum 120) 220 200 180 Temperature (˚C) 220 Maximum 240˚C Time (seconds) |
类似零件编号 - UA2-5SNUN-L |
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类似说明 - UA2-5SNUN-L |
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