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HCPL-270L500 数据表(PDF) 2 Page - Agilent(Hewlett-Packard) |
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HCPL-270L500 数据表(HTML) 2 Page - Agilent(Hewlett-Packard) |
2 / 12 page 2 Selection Guide 8-Pin DIP (300 Mil) Small Outline SO-8 Single Channel Dual Channel Single Channel Dual Channel Minimum Input Package HCPL- Package HCPL- Package HCPL- Package HCPL- ON Current (IF) Minimum CTR 270L 273L 070L 073L 0.5 mA 400% 1.6 mA 300% Ordering Information Specify Part Number followed by Option Number (if desired). Example: HCPL-270L #XXX 060 = VDE 0884 VIORM = 630 Vpeak Option 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Agilent sales representative or authorized distributor for information. Schematic The HCPL-070L and HCPL-073L are surface mount devices packaged in an industry standard SOIC-8 footprint. The SOIC-8 does not require "through holes" in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. IF2 6 5 GND 3 4 VO2 VF2 IO2 + – IF1 8 7 V CC 1 2 V O1 ICC V F1 IO1 – + SHIELD USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED HCPL-270L/HCPL-070L HCPL-273L/HCPL-073L IF 8 VCC 2 3 ICC VF ANODE CATHODE + – VB IB 6 5 GND VO IO 7 SHIELD |
类似零件编号 - HCPL-270L500 |
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类似说明 - HCPL-270L500 |
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