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LM2585T-12 数据表(PDF) 5 Page - National Semiconductor (TI) |
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LM2585T-12 数据表(HTML) 5 Page - National Semiconductor (TI) |
5 / 25 page Electrical Characteristics (All Versions) (Continued) Note 3: The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance (θJA), and the power dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction temperature of the device: PD x θJA +TA(MAX) ≥ TJ- (MAX) . For a safe thermal design, check that the maximum power dissipated by the device is less than: PD ≤ [TJ(MAX) −TA(MAX))]/θJA. When calculating the maximum allowable power dissipation, derate the maximum junction temperature — this ensures a margin of safety in the thermal design. Note 4: External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the LM2585 is used as shown in Figures Figure 2 and Figure 3 , system performance will be as specified by the system parameters. Note 5: All room temperature limits are 100% production tested, and all limits at temperature extremes are guaranteed via correlation using standard Statistical Qual- ity Control (SQC) methods. Note 6: A 1.0 M Ω resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL. Note 7: To measure this parameter, the feedback voltage is set to a low value, depending on the output version of the device, to force the error amplifier output high. Adj: VFB = 1.05V; 3.3V: VFB = 2.81V; 5.0V: VFB = 4.25V; 12V: VFB = 10.20V. Note 8: To measure this parameter, the feedback voltage is set to a high value, depending on the output version of the device, to force the error amplifier output low. Adj: VFB = 1.41V; 3.3V: VFB = 3.80V; 5.0V: VFB = 5.75V; 12V: VFB = 13.80V. Note 9: To measure the worst-case error amplifier output current, the LM2585 is tested with the feedback voltage set to its low value (specified in (Note 7) and at its high value (specified in (Note 8) . Note 10: Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with 1⁄2 inch leads in a socket, or on a PC board with minimum copper area. Note 11: Junction to ambient thermal resistance (no external heat sink) for the 5 lead TO-220 package mounted vertically, with 1⁄2 inch leads soldered to a PC board containing approximately 4 square inches of (1oz.) copper area surrounding the leads. Note 12: Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Note 13: Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Note 14: Junction to ambient thermal resistance for the 5 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal resistance further. See the thermal model in Switchers Made Simple software. Typical Performance Characteristics Supply Current vs Temperature DS012515-2 Reference Voltage vs Temperature DS012515-3 ∆Reference Voltage vs Supply Voltage DS012515-4 Supply Current vs Switch Current DS012515-5 Current Limit vs Temperature DS012515-6 Feedback Pin Bias Current vs Temperature DS012515-7 www.national.com 5 |
类似零件编号 - LM2585T-12 |
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类似说明 - LM2585T-12 |
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