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GS81313LD18 数据表(PDF) 1 Page - GSI Technology |
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GS81313LD18 数据表(HTML) 1 Page - GSI Technology |
1 / 26 page GS81313LD18/36GK-833/714/625 144Mb SigmaQuad-IIIe™ Burst of 4 ECCRAM™ Up to 833 MHz 1.25V ~ 1.3V VDD 1.2V ~ 1.3V VDDQ Rev: 1.13 7/2016 1/26 © 2014, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. 260-Pin BGA Com & Ind Temp HSTL I/O Features • 4Mb x 36 and 8Mb x 18 organizations available • 833 MHz maximum operating frequency • 833 MT/s peak transaction rate (in millions per second) • 120 Gb/s peak data bandwidth (in x36 devices) • Separate I/O DDR Data Buses • Non-multiplexed SDR Address Bus • One operation - Read or Write - per clock cycle • Burst of 4 Read and Write operations • 3 cycle Read Latency • On-chip ECC with virtually zero SER • 1.25V ~ 1.3V core voltage • 1.2V ~ 1.3V HSTL I/O interface • Configurable ODT (on-die termination) • ZQ pin for programmable driver impedance • ZT pin for programmable ODT impedance • IEEE 1149.1 JTAG-compliant Boundary Scan • 260-pin, 14 mm x 22 mm, 1 mm ball pitch, 6/6 RoHS- compliant BGA package SigmaQuad-IIIe™ Family Overview SigmaQuad-IIIe ECCRAMs are the Separate I/O half of the SigmaQuad-IIIe/SigmaDDR-IIIe family of high performance ECCRAMs. Although very similar to GSI's second generation of networking SRAMs (the SigmaQuad-II/SigmaDDR-II family), these third generation devices offer several new features that help enable significantly higher performance. Clocking and Addressing Schemes The GS81313LD18/36GK SigmaQuad-IIIe ECCRAMs are synchronous devices. They employ three pairs of positive and negative input clocks; one pair of master clocks, CK and CK, and two pairs of write data clocks, KD[1:0] and KD[1:0]. All six input clocks are single-ended; that is, each is received by a dedicated input buffer. CK and CK are used to latch address and control inputs, and to control all output timing. KD[1:0] and KD[1:0] are used solely to latch data inputs. Each internal read and write operation in a SigmaQuad-IIIe B4 ECCRAM is four times wider than the device I/O bus. An input data bus de-multiplexer is used to accumulate incoming data before it is simultaneously written to the memory array. An output data multiplexer is used to capture the data produced from a single memory array read and then route it to the appropriate output drivers as needed. Therefore, the address field of a SigmaQuad-IIIe B4 ECCRAM is always two address pins less than the advertised index depth (e.g. the 8M x 18 has 2M addressable index). On-Chip Error Correction Code GSI's ECCRAMs implement an ECC algorithm that detects and corrects all single-bit memory errors, including those induced by SER events such as cosmic rays, alpha particles, etc. The resulting Soft Error Rate of these devices is anticipated to be <0.002 FITs/Mb — a 5-order-of-magnitude improvement over comparable SRAMs with no on-chip ECC, which typically have an SER of 200 FITs/Mb or more. All quoted SER values are at sea level in New York City. Parameter Synopsis Speed Grade Max Operating Frequency Read Latency VDD -833 833 MHz 3 cycles 1.2V to 1.35V -714 714 MHz 3 cycles 1.2V to 1.35V -625 625 MHz 3 cycles 1.2V to 1.35V |
类似零件编号 - GS81313LD18 |
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类似说明 - GS81313LD18 |
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